Mechanical strain engineering has been promising for many integrated photonic applications. However, for the engineering of a material electronic bandgap, a trade-off exists between the strain uniformity and the integration compatibility with photonic-integrated circuits (PICs). Herein, we adopted a straightforward recess-type design of a silicon nitride (SiNx) stressor to achieve a uniform strain with enhanced magnitude in the material of interest on PICs. Normal-incidence, uniformly 0.56% tensile strained germanium (Ge)-on-insulator (GOI) metal-semiconductor-metal photodiodes were demonstrated, using the recessed stressor with 750 MPa tensile stress. The device exhibits a responsivity of 1.84±0.15A/W at 1550 nm. The extracted Ge absorption coefficient is enhanced by ～3.2× to 8340cm-1 at 1612 nm and is superior to that of In0.53Ga0.47As up to 1630 nm limited by the measurement spectrum. Compared with the nonrecess strained device, additional absorption coefficient improvement of 10%–20% in the C-band and 40%–60% in the L-band was observed. This work facilitates the recess-strained GOI photodiodes for free-space PIC applications and paves the way for various (e.g., Ge, GeSn or III-V based) uniformly strained photonic devices on PICs.

In this paper, normal incidence vertical p-i-n photodetectors on a germanium-on-insulator (GOI) platform were demonstrated. The vertical p-i-n structure was realized by ion-implanting boron and arsenic at the bottom and top of the Ge layer, respectively, during the GOI fabrication. Abrupt doping profiles were verified in the transferred high-quality Ge layer. The photodetectors exhibit a dark current density of ～47 mA/cm2 at ?1 V and an optical responsivity of 0.39 A/W at 1550 nm, which are improved compared with state-of-the-art demonstrated GOI photodetectors. An internal quantum efficiency of ～97% indicates excellent carrier collection efficiency of the device. The photodetectors with mesa diameter of 60 μm exhibit a 3 dB bandwidth of ～1 GHz, which agrees well with theoretical calculations. The bandwidth is expected to improve to ～32 GHz with mesa diameter of 10 μm. This work could be similarly extended to GOI platforms with other intermediate layers and potentially enrich the functional diversity of GOI for near-infrared sensing and communication integrated with Ge CMOS and mid-infrared photonics.